Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9455224 | Semiconductor interconnect structures | Boyan Boyanov, James S. Clarke, Alan M. Myers | 2016-09-27 | $16,083,000 |
| 9406512 | Self-aligned via patterning with multi-colored photobuckets for back end of line (BEOL) interconnects | Robert L. Bristol, James M. Blackwell, Alan M. Myers | 2016-08-02 | $8,723,000 |
| 9406615 | Techniques for forming interconnects in porous dielectric materials | Christopher J. Jezewski, David J. Michalak, Alan M. Myers | 2016-08-02 | $8,723,000 |
| 9379010 | Methods for forming interconnect layers having tight pitch interconnect structures | Christopher J. Jezewski, Jasmeet S. Chawla, Alan M. Myers, Elliot N. Tan, Richard E. Schenker | 2016-06-28 | $11,945,000 |
| 9373584 | Methods and apparatuses to form self-aligned caps | Boyan Boyanov | 2016-06-21 | $13,200,000 |
| 9236342 | Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects | Robert L. Bristol, Kevin Lin, Alan M. Myers, Richard E. Schenker | 2016-01-12 | $15,498,000 |