| 9455224 |
Semiconductor interconnect structures |
Boyan Boyanov, James S. Clarke, Alan M. Myers |
2016-09-27 |
| 9406512 |
Self-aligned via patterning with multi-colored photobuckets for back end of line (BEOL) interconnects |
Robert L. Bristol, James M. Blackwell, Alan M. Myers |
2016-08-02 |
| 9406615 |
Techniques for forming interconnects in porous dielectric materials |
Christopher J. Jezewski, David J. Michalak, Alan M. Myers |
2016-08-02 |
| 9379010 |
Methods for forming interconnect layers having tight pitch interconnect structures |
Christopher J. Jezewski, Jasmeet S. Chawla, Alan M. Myers, Elliot N. Tan, Richard E. Schenker |
2016-06-28 |
| 9373584 |
Methods and apparatuses to form self-aligned caps |
Boyan Boyanov |
2016-06-21 |
| 9236342 |
Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects |
Robert L. Bristol, Kevin Lin, Alan M. Myers, Richard E. Schenker |
2016-01-12 |