Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9455224 | Semiconductor interconnect structures | Boyan Boyanov, Kanwal Jit Singh, James S. Clarke | 2016-09-27 |
| 9406512 | Self-aligned via patterning with multi-colored photobuckets for back end of line (BEOL) interconnects | Robert L. Bristol, James M. Blackwell, Kanwal Jit Singh | 2016-08-02 |
| 9406615 | Techniques for forming interconnects in porous dielectric materials | Christopher J. Jezewski, David J. Michalak, Kanwal Jit Singh | 2016-08-02 |
| 9379010 | Methods for forming interconnect layers having tight pitch interconnect structures | Christopher J. Jezewski, Jasmeet S. Chawla, Kanwal Jit Singh, Elliot N. Tan, Richard E. Schenker | 2016-06-28 |
| 9236342 | Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects | Robert L. Bristol, Kevin Lin, Kanwal Jit Singh, Richard E. Schenker | 2016-01-12 |