Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9379010 | Methods for forming interconnect layers having tight pitch interconnect structures | Christopher J. Jezewski, Jasmeet S. Chawla, Kanwal Jit Singh, Alan M. Myers, Richard E. Schenker | 2016-06-28 |