Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520299 | Etch bias control | Wanbing Yi, Chin Chuan Neo, Kin Wai Tang, Weining Li, Juan Boon Tan | 2016-12-13 |
| 9437550 | TSV without zero alignment marks | Shunqiang Gong, Juan Boon Tan, Wei Liu | 2016-09-06 |
| 9230886 | Method for forming through silicon via with wafer backside protection | Lup San Leong, Zheng Zou, Alex See, Xuesong Rao, Yun Ling Tan +1 more | 2016-01-05 |