Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9511470 | CMP head structure with retaining ring | Benfu Lin, Lei Wang, Wei Lu, Alex See | 2016-12-06 |
| 9349654 | Isolation for embedded devices | Liang Li, Martina Damayanti, Wei Lu, Alex See, Yoke Leng Lim | 2016-05-24 |
| 9293388 | Reliable passivation layers for semiconductor devices | Meng Meng Chong, Chim Seng Seet, Hendro Mario, Aison John George, Chor Shu CHENG | 2016-03-22 |
| 9242338 | CMP head structure | Benfu Lin, Lei Wang, Wei Lu, Alex See | 2016-01-26 |
| 9230886 | Method for forming through silicon via with wafer backside protection | Lup San Leong, Zheng Zou, Alex See, Hai Cong, Yun Ling Tan +1 more | 2016-01-05 |