Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9437547 | Through silicon vias | Benfu Lin, Hong-Chi Yu, Alex See, Wei Lu | 2016-09-06 |
| 9287197 | Through silicon vias | Benfu Lin, Hong-Chi Yu, Alex See, Wei Lu | 2016-03-15 |
| 9230886 | Method for forming through silicon via with wafer backside protection | Zheng Zou, Alex See, Hai Cong, Xuesong Rao, Yun Ling Tan +1 more | 2016-01-05 |