Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349654 | Isolation for embedded devices | Liang Li, Xuesong Rao, Martina Damayanti, Wei Lu, Yoke Leng Lim | 2016-05-24 |
| 9242338 | CMP head structure | Benfu Lin, Lei Wang, Xuesong Rao, Wei Lu | 2016-01-26 |
| 9242341 | CMP head structure | Benfu Lin, Wei Lu | 2016-01-26 |
| 9230886 | Method for forming through silicon via with wafer backside protection | Lup San Leong, Zheng Zou, Hai Cong, Xuesong Rao, Yun Ling Tan +1 more | 2016-01-05 |