Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9230886 | Method for forming through silicon via with wafer backside protection | Lup San Leong, Zheng Zou, Alex See, Hai Cong, Xuesong Rao +1 more | 2016-01-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9230886 | Method for forming through silicon via with wafer backside protection | Lup San Leong, Zheng Zou, Alex See, Hai Cong, Xuesong Rao +1 more | 2016-01-05 |