Issued Patents 2016
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520371 | Planar passivation for pads | Benfu Lin, Wanbing Yi, Alex See, Juan Boon Tan | 2016-12-13 |
| 9511474 | CMP head structure with retaining ring | Benfu Lin, Alex See | 2016-12-06 |
| 9511470 | CMP head structure with retaining ring | Benfu Lin, Lei Wang, Xuesong Rao, Alex See | 2016-12-06 |
| 9443761 | Methods for fabricating integrated circuits having device contacts | Wei Shao, Fan Zhang, Wuping Liu, Vish Srinivasan, Juan Boon Tan | 2016-09-13 |
| 9437547 | Through silicon vias | Benfu Lin, Hong-Chi Yu, Lup San Leong, Alex See | 2016-09-06 |
| 9349654 | Isolation for embedded devices | Liang Li, Xuesong Rao, Martina Damayanti, Alex See, Yoke Leng Lim | 2016-05-24 |
| 9287197 | Through silicon vias | Benfu Lin, Hong-Chi Yu, Lup San Leong, Alex See | 2016-03-15 |
| 9242338 | CMP head structure | Benfu Lin, Lei Wang, Xuesong Rao, Alex See | 2016-01-26 |
| 9242341 | CMP head structure | Benfu Lin, Alex See | 2016-01-26 |