Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9437550 | TSV without zero alignment marks | Shunqiang Gong, Juan Boon Tan, Hai Cong | 2016-09-06 |
| 9362171 | Through via contacts with insulated substrate | Shunqiang Gong, Juan Boon Tan | 2016-06-07 |