Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9437550 | TSV without zero alignment marks | Juan Boon Tan, Wei Liu, Hai Cong | 2016-09-06 |
| 9362171 | Through via contacts with insulated substrate | Juan Boon Tan, Wei Liu | 2016-06-07 |
| 9240374 | Semiconductor device and method of forming thereof | Wei Shao, Wanbing Yi, Chao Zhu, Juan Boon Tan | 2016-01-19 |