Issued Patents 2011
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076241 | Methods for multi-step copper plating on a continuous ruthenium film in recessed features | Frank M. Cerio, Jr., Shigeru Mizuno, Thomas A. Ponnuswamy | 2011-12-13 |
| 8048280 | Process for electroplating metals into microscopic recessed features | Steven T. Mayer, Vijay Bhaskaran, Evan E. Patton, Robert Jackson | 2011-11-01 |
| 8043958 | Capping before barrier-removal IC fabrication method | Eric G. Webb, Edmund Minshall, Avishai Kepten, R. Marshall Stowell, Steven T. Mayer | 2011-10-25 |
| 8043967 | Process for through silicon via filling | Katie Qun Wang, Mark J. Wiley | 2011-10-25 |
| 7967969 | Method of electroplating using a high resistance ionic current source | Steven T. Mayer | 2011-06-28 |
| 7964506 | Two step copper electroplating process with anneal for uniform across wafer deposition and void free filling on ruthenium coated wafers | Thomas A. Ponnuswamy, John Sukamto, Steve Mayer | 2011-06-21 |
| 7897198 | Electroless layer plating process and apparatus | Heung Lak Park, Eric G. Webb, Timothy Cleary | 2011-03-01 |