Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8043958 | Capping before barrier-removal IC fabrication method | Jonathan D. Reid, Edmund Minshall, Avishai Kepten, R. Marshall Stowell, Steven T. Mayer | 2011-10-25 |
| 7972970 | Fabrication of semiconductor interconnect structure | Steven T. Mayer, Daniel A. Koos | 2011-07-05 |
| 7947163 | Photoresist-free metal deposition | Steven T. Mayer, John Drewery | 2011-05-24 |
| 7897198 | Electroless layer plating process and apparatus | Heung Lak Park, Jonathan D. Reid, Timothy Cleary | 2011-03-01 |
| 7879218 | Deposit morphology of electroplated copper | Jon Reid, Yuichi Takada, Timothy M. Archer | 2011-02-01 |