Issued Patents 2011
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D648289 | Electroplating flow shaping plate having offset spiral hole pattern | David W. Porter, Robert Rash | 2011-11-08 |
| 8053861 | Diffusion barrier layers | Thomas W. Mountsier, Roey Shaviv, Ronald A. Powell | 2011-11-08 |
| 8048280 | Process for electroplating metals into microscopic recessed features | Vijay Bhaskaran, Evan E. Patton, Robert Jackson, Jonathan D. Reid | 2011-11-01 |
| 8043958 | Capping before barrier-removal IC fabrication method | Jonathan D. Reid, Eric G. Webb, Edmund Minshall, Avishai Kepten, R. Marshall Stowell | 2011-10-25 |
| 8026174 | Sequential station tool for wet processing of semiconductor wafers | Evan E. Patton, Theodore Cacouris, Eliot K. Broadbent | 2011-09-27 |
| 7972970 | Fabrication of semiconductor interconnect structure | Daniel A. Koos, Eric G. Webb | 2011-07-05 |
| 7967969 | Method of electroplating using a high resistance ionic current source | Jonathan D. Reid | 2011-06-28 |
| 7947163 | Photoresist-free metal deposition | John Drewery, Eric G. Webb | 2011-05-24 |