Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8048280 | Process for electroplating metals into microscopic recessed features | Steven T. Mayer, Vijay Bhaskaran, Robert Jackson, Jonathan D. Reid | 2011-11-01 |
| 8026174 | Sequential station tool for wet processing of semiconductor wafers | Theodore Cacouris, Eliot K. Broadbent, Steven T. Mayer | 2011-09-27 |