Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076241 | Methods for multi-step copper plating on a continuous ruthenium film in recessed features | Frank M. Cerio, Jr., Jonathan D. Reid, Thomas A. Ponnuswamy | 2011-12-13 |
| 8058728 | Diffusion barrier and adhesion layer for an interconnect structure | Tadahiro Ishizaka | 2011-11-15 |
| 8026168 | Semiconductor device containing an aluminum tantalum carbonitride barrier film and method of forming | Tadahiro Ishizaka | 2011-09-27 |
| 7935393 | Method and system for improving sidewall coverage in a deposition system | Takashi Sakuma, Yasushi Mizusawa | 2011-05-03 |