Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076241 | Methods for multi-step copper plating on a continuous ruthenium film in recessed features | Shigeru Mizuno, Jonathan D. Reid, Thomas A. Ponnuswamy | 2011-12-13 |
| 7901545 | Ionized physical vapor deposition (iPVD) process | Jacques Faguet, Bruce Gittleman, Rodney L. Robison | 2011-03-08 |
| 7892406 | Ionized physical vapor deposition (iPVD) process | — | 2011-02-22 |
| 7871929 | Method of forming semiconductor devices containing metal cap layers | Noel Russell, Gregory Herdt | 2011-01-18 |