Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076241 | Methods for multi-step copper plating on a continuous ruthenium film in recessed features | Frank M. Cerio, Jr., Shigeru Mizuno, Jonathan D. Reid | 2011-12-13 |
| 7964506 | Two step copper electroplating process with anneal for uniform across wafer deposition and void free filling on ruthenium coated wafers | John Sukamto, Jonathan D. Reid, Steve Mayer | 2011-06-21 |