Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7959985 | Method of integrating PEALD Ta-containing films into Cu metallization | Tadahiro Ishizaka, Tsukasa Matsuda, Masamichi Hara, Yasushi Mizusawa | 2011-06-14 |
| 7901545 | Ionized physical vapor deposition (iPVD) process | Frank M. Cerio, Jr., Bruce Gittleman, Rodney L. Robison | 2011-03-08 |
| 7897217 | Method and system for performing plasma enhanced atomic layer deposition | — | 2011-03-01 |