Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8063472 | Semiconductor package with stacked dice for a buck converter | Yong Liu, William Robert Newberry, Qiuxiao Qian | 2011-11-22 |
| 8030743 | Semiconductor package with an embedded printed circuit board and stacked die | Yong Liu, Hua Yang, Yumin Liu, Tiburcio A. Maldo | 2011-10-04 |
| 7932171 | Dual metal stud bumping for flip chip applications | Rajeev Joshi, Consuelo Tangpuz, Erwin Victor Cruz | 2011-04-26 |