Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058107 | Semiconductor die package using leadframe and clip and method of manufacturing | Elsie Agdon Cabahug, Ti Ching Shian, Venkat Iyer | 2011-11-15 |
| 8008759 | Pre-molded clip structure | Maria Cristina Estacio | 2011-08-30 |
| 7972906 | Semiconductor die package including exposed connections | Maria Cristina Estacio | 2011-07-05 |
| 7932171 | Dual metal stud bumping for flip chip applications | Rajeev Joshi, Consuelo Tangpuz, Margie T. Rios | 2011-04-26 |