Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058107 | Semiconductor die package using leadframe and clip and method of manufacturing | Erwin Victor Cruz, Ti Ching Shian, Venkat Iyer | 2011-11-15 |
| 7906837 | Robust leaded molded packages and methods for forming the same | Marvin Gestole, Margie Sebial Tumulak-Rios, Lilith U. Montayre, Romel N. Manatad | 2011-03-15 |