Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058107 | Semiconductor die package using leadframe and clip and method of manufacturing | Erwin Victor Cruz, Elsie Agdon Cabahug, Venkat Iyer | 2011-11-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058107 | Semiconductor die package using leadframe and clip and method of manufacturing | Erwin Victor Cruz, Elsie Agdon Cabahug, Venkat Iyer | 2011-11-15 |