Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8008759 | Pre-molded clip structure | Erwin Victor Cruz | 2011-08-30 |
| 7972906 | Semiconductor die package including exposed connections | Erwin Victor Cruz | 2011-07-05 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8008759 | Pre-molded clip structure | Erwin Victor Cruz | 2011-08-30 |
| 7972906 | Semiconductor die package including exposed connections | Erwin Victor Cruz | 2011-07-05 |