Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7971350 | Method of providing a RF shield of an electronic device | — | 2011-07-05 |
| 7968982 | Thermal enhanced upper and dual heat sink exposed molded leadless package | Chung-Lin Wu | 2011-06-28 |
| 7932171 | Dual metal stud bumping for flip chip applications | Consuelo Tangpuz, Margie T. Rios, Erwin Victor Cruz | 2011-04-26 |
| 7892884 | High performance multi-chip flip chip package | — | 2011-02-22 |