Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058732 | Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the same | Michael D. Gruenhagen, Suku Kim, James J. Murphy, Ihsiu Ho, Eddy Tjhia +2 more | 2011-11-15 |
| 7968982 | Thermal enhanced upper and dual heat sink exposed molded leadless package | Rajeev Joshi | 2011-06-28 |
| 7960800 | Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same | Michael D. Gruenhagen, Suku Kim, James J. Murphy, Eddy Tjhia, Mark Larsen +1 more | 2011-06-14 |