Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8072027 | 3D channel architecture for semiconductor devices | Suku Kim, Dan Calafut, Dan Kinzer, Steven Sapp, Ashok Challa +2 more | 2011-12-06 |
| 8058732 | Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the same | Michael D. Gruenhagen, Suku Kim, James J. Murphy, Eddy Tjhia, Chung-Lin Wu +2 more | 2011-11-15 |
| 8003522 | Method for forming trenches with wide upper portion and narrow lower portion | Hui-Chi Chen, Stacy W. Hall, Briant Harward, Hossein Paravi | 2011-08-23 |
| 7989884 | Structure for making a top-side contact to a substrate | Chun-Tai Wu | 2011-08-02 |
| 7884390 | Structure and method of forming a topside contact to a backside terminal of a semiconductor device | John T. Andrews, Hamza Yilmaz, Bruce D. Marchant | 2011-02-08 |