Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8072027 | 3D channel architecture for semiconductor devices | Dan Calafut, Ihsiu Ho, Dan Kinzer, Steven Sapp, Ashok Challa +2 more | 2011-12-06 |
| 8058732 | Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the same | Michael D. Gruenhagen, James J. Murphy, Ihsiu Ho, Eddy Tjhia, Chung-Lin Wu +2 more | 2011-11-15 |
| 7960800 | Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same | Michael D. Gruenhagen, James J. Murphy, Eddy Tjhia, Chung-Lin Wu, Mark Larsen +1 more | 2011-06-14 |
| 7951688 | Method and structure for dividing a substrate into individual devices | Minhua Li, Qi Wang, Gordon Sim, Matthew Reynolds, James J. Murphy +1 more | 2011-05-31 |