Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058732 | Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the same | Michael D. Gruenhagen, Suku Kim, Ihsiu Ho, Eddy Tjhia, Chung-Lin Wu +2 more | 2011-11-15 |
| 7960800 | Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same | Michael D. Gruenhagen, Suku Kim, Eddy Tjhia, Chung-Lin Wu, Mark Larsen +1 more | 2011-06-14 |
| 7956411 | High aspect ratio trench structures with void-free fill material | Hui-Chi Chen, Eileen Valdez | 2011-06-07 |
| 7951688 | Method and structure for dividing a substrate into individual devices | Minhua Li, Qi Wang, Gordon Sim, Matthew Reynolds, Suku Kim +1 more | 2011-05-31 |
| 7936009 | Shielded gate trench FET with an inter-electrode dielectric having a low-k dielectric therein | James Pan | 2011-05-03 |