Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030743 | Semiconductor package with an embedded printed circuit board and stacked die | Yong Liu, Margie T. Rios, Hua Yang, Tiburcio A. Maldo | 2011-10-04 |
| 7973393 | Stacked micro optocouplers and methods of making the same | Yong Liu | 2011-07-05 |
| 7952204 | Semiconductor die packages with multiple integrated substrates, systems using the same, and methods using the same | Hua Yang, Yong Liu, Tiburcio A. Maldo | 2011-05-31 |