Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030743 | Semiconductor package with an embedded printed circuit board and stacked die | Yong Liu, Margie T. Rios, Hua Yang, Yumin Liu | 2011-10-04 |
| 7952204 | Semiconductor die packages with multiple integrated substrates, systems using the same, and methods using the same | Yumin Liu, Hua Yang, Yong Liu | 2011-05-31 |
| 7902646 | Multiphase synchronous buck converter | Yong Liu, Hua Yang | 2011-03-08 |