Issued Patents 2011
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8082525 | Technique for correcting hotspots in mask patterns and write patterns | John F. McCarty, Kelly Gordon Russell, Linyong Pang | 2011-12-20 |
| 8063474 | Embedded die package on package (POP) with pre-molded leadframe | Qiuxiao Qian | 2011-11-22 |
| 8063472 | Semiconductor package with stacked dice for a buck converter | William Robert Newberry, Margie T. Rios, Qiuxiao Qian | 2011-11-22 |
| 8030743 | Semiconductor package with an embedded printed circuit board and stacked die | Margie T. Rios, Hua Yang, Yumin Liu, Tiburcio A. Maldo | 2011-10-04 |
| 8023279 | FLMP buck converter with a molded capacitor and a method of the same | Qiuxiao Qian | 2011-09-20 |
| 8018054 | Semiconductor die package including multiple semiconductor dice | Qiuxiao Qian | 2011-09-13 |
| 7973393 | Stacked micro optocouplers and methods of making the same | Yumin Liu | 2011-07-05 |
| 7952204 | Semiconductor die packages with multiple integrated substrates, systems using the same, and methods using the same | Yumin Liu, Hua Yang, Tiburcio A. Maldo | 2011-05-31 |
| 7934430 | Die scale strain gauge | Scott Irving, Timwah Luk | 2011-05-03 |
| 7915721 | Semiconductor die package including IC driver and bridge | Jiangyuan Zhang, Qiuxiao Qian | 2011-03-29 |
| 7902646 | Multiphase synchronous buck converter | Tiburcio A. Maldo, Hua Yang | 2011-03-08 |