Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8063472 | Semiconductor package with stacked dice for a buck converter | Yong Liu, William Robert Newberry, Margie T. Rios | 2011-11-22 |
| 8063474 | Embedded die package on package (POP) with pre-molded leadframe | Yong Liu | 2011-11-22 |
| 8023279 | FLMP buck converter with a molded capacitor and a method of the same | Yong Liu | 2011-09-20 |
| 8018054 | Semiconductor die package including multiple semiconductor dice | Yong Liu | 2011-09-13 |
| 7915721 | Semiconductor die package including IC driver and bridge | Yong Liu, Jiangyuan Zhang | 2011-03-29 |