Issued Patents 2005
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6962869 | SiOCH low k surface protection layer formation by CxHy gas plasma treatment | Hsin-Hsien Lu, Lih-Ping Li, Chung-Chi Ko, Aaron Song, Syun-Ming Jang | 2005-11-08 |
| 6924242 | SiOC properties and its uniformity in bulk for damascene applications | Syun-Ming Jang, Chung-Chi Ko, Lih-Ping Li, Al-Sen Liu | 2005-08-02 |
| 6887790 | Method of forming dummy copper plug to improve low k structure mechanical strength and plug fill uniformity | Bi-Trong Chen, Ying-Ho Chen | 2005-05-03 |
| 6884659 | Thin interface layer to improve copper etch stop | Bi-Trong Chen, Lain-Jong Li, Syun-Ming Jang, Shu E Ku, Lih-Ping Li | 2005-04-26 |
| 6867135 | Via bottom copper/barrier interface improvement to resolve via electromigration and stress migration | Syun-Ming Jang | 2005-03-15 |
| 6861754 | Semiconductor device with anchor type seal ring | Kang-Cheng Lin | 2005-03-01 |