Issued Patents 2005
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6946397 | Chemical mechanical polishing process with reduced defects in a copper process | William Weilun Hong, Chia-Che CHUNG, Chi-Wei Chung, Wen-Chih Chiou, Syun-Ming Jang | 2005-09-20 |
| 6930040 | Method of forming a contact on a silicon-on-insulator wafer | Chuan-Ping Hou, Syun-Ming Jang, Tung-Ching Tseng | 2005-08-16 |
| 6924238 | Edge peeling improvement of low-k dielectric materials stack by adjusting EBR resistance | Tzu-Jen Chou, Syun-Ming Jang, Shen-Nan Lee | 2005-08-02 |
| 6919276 | Method to reduce dishing and erosion in a CMP process | Shen-Nan Lee, Syun-Ming Jang, Tzu-Jen Chou, Jin-Yiing Song | 2005-07-19 |
| 6887790 | Method of forming dummy copper plug to improve low k structure mechanical strength and plug fill uniformity | Tien-I Bao, Bi-Trong Chen | 2005-05-03 |
| 6869858 | Shallow trench isolation planarized by wet etchback and chemical mechanical polishing | Syun-Ming Jang | 2005-03-22 |