Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6946397 | Chemical mechanical polishing process with reduced defects in a copper process | William Weilun Hong, Chia-Che CHUNG, Chi-Wei Chung, Ying-Ho Chen, Syun-Ming Jang | 2005-09-20 |
| 6849549 | Method for forming dummy structures for improved CMP and reduced capacitance | Syun-Ming Jang | 2005-02-01 |
| 6846756 | Method for preventing low-k dielectric layer cracking in multi-layered dual damascene metallization layers | Shing-Chyang Pan, Keng-Chu Lin, Shwang-Ming Jeng | 2005-01-25 |