Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6846756 | Method for preventing low-k dielectric layer cracking in multi-layered dual damascene metallization layers | Shing-Chyang Pan, Wen-Chih Chiou, Shwang-Ming Jeng | 2005-01-25 |