Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6962869 | SiOCH low k surface protection layer formation by CxHy gas plasma treatment | Tien-I Bao, Hsin-Hsien Lu, Chung-Chi Ko, Aaron Song, Syun-Ming Jang | 2005-11-08 |
| 6958524 | Insulating layer having graded densification | Yung-Cheng Lu | 2005-10-25 |
| 6924242 | SiOC properties and its uniformity in bulk for damascene applications | Syun-Ming Jang, Chung-Chi Ko, Tien-I Bao, Al-Sen Liu | 2005-08-02 |
| 6884659 | Thin interface layer to improve copper etch stop | Bi-Trong Chen, Lain-Jong Li, Syun-Ming Jang, Shu E Ku, Tien-I Bao | 2005-04-26 |
| 6867126 | Method to increase cracking threshold for low-k materials | Yung-Chen Lu, Chung-Chi Ko | 2005-03-15 |