Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6878621 | Method of fabricating barrierless and embedded copper damascene interconnects | Zhen-Cheng Wu, Lain-Jong Li, Syun-Ming Jang | 2005-04-12 |
| 6867126 | Method to increase cracking threshold for low-k materials | Lih-Ping Li, Chung-Chi Ko | 2005-03-15 |