Issued Patents 2005
Showing 51–60 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6861763 | Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same | — | 2005-03-01 |
| 6861745 | Method and apparatus for conducting heat in a flip-chip assembly | Alan G. Wood | 2005-03-01 |
| 6853069 | Packaged die on PCB with heat sink encapsulant and methods | James M. Wark | 2005-02-08 |
| 6853211 | Method and system having switching network for testing semiconductor components on a substrate | C. Patrick Doherty, Jorge L. de Varona | 2005-02-08 |
| 6853210 | Test interconnect having suspended contacts for bumped semiconductor components | Warren M. Farnworth | 2005-02-08 |
| 6852613 | High permeability thin films and patterned thin films to reduce noise in high speed interconnections | Leonard Forbes, Kie Y. Ahn | 2005-02-08 |
| 6847110 | Method and apparatus for conducting heat in a flip-chip assembly | Alan G. Wood | 2005-01-25 |
| 6846738 | High permeability composite films to reduce noise in high speed interconnects | Leonard Forbes, Kie Y. Ahn | 2005-01-25 |
| 6844256 | High permeability composite films to reduce noise in high speed interconnects | Leonard Forbes, Kie Y. Ahn | 2005-01-18 |
| 6841868 | Memory modules including capacity for additional memory | James M. Wark, David R. Hembree | 2005-01-11 |