Issued Patents 2005
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6936535 | Copper interconnect structure having stuffed diffusion barrier | Ki Bum Kim, Ivo Raaijmakers | 2005-08-30 |
| 6921712 | Process for producing integrated circuits including reduction using gaseous organic compounds | Kai-Erik Elers | 2005-07-26 |
| 6902763 | Method for depositing nanolaminate thin films on sensitive surfaces | Kai-Erik Elers, Suvi Haukka, Ville Antero Saanila, Sari Johanna Kaipio | 2005-06-07 |
| 6887795 | Method of growing electrical conductors | Kai-Erik Elers, Suvi Haukka | 2005-05-03 |
| 6878628 | In situ reduction of copper oxide prior to silicon carbide deposition | Auguste Sophie, Hessel Sprey, Kai-Erik Elers | 2005-04-12 |
| 6863727 | Method of depositing transition metal nitride thin films | Kai-Erik Elers, Suvi Haukka, Ville Antero Saanila, Sari Johanna Kaipio | 2005-03-08 |
| 6852635 | Method for bottomless deposition of barrier layers in integrated circuit metallization schemes | Alessandra Satta, Karen Maex, Kai-Erik Elers, Ville Antero Saanila, Suvi Haukka | 2005-02-08 |