Issued Patents 2004
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6802250 | Stencil design for solder paste printing | Chao-Yuan Su, Chia-Fu Lin, Hsin-Hui Lee, Yen-Ming Chen, Li-Chih Chen | 2004-10-12 |
| 6797075 | Ferris wheel-like stripping or cleaning mechanism for semiconductor fabrication | Chia-Fu Lin, Wen-Hsiang Tseng, Ta-Min Lin, Yen-Ming Chen, Hsin-Hui Lee | 2004-09-28 |
| 6756294 | Method for improving bump reliability for flip chip devices | Yen-Ming Chen, Chia-Fu Lin, Shun-Liang Hsu, Hsin-Hui Lee, Chao-Yuan Su +1 more | 2004-06-29 |
| 6743660 | Method of making a wafer level chip scale package | Hsin-Hui Lee, Chia-Fu Lin, Chao-Yuan Su, Yen-Ming Chen, Li-Chih Chen | 2004-06-01 |
| 6715524 | DFR laminating and film removing system | Li-Chen Chen, Chia-Tsun Hsu, Chia-Fu Lin, Kuo-Ching Lee, Yen-Ming Chen +2 more | 2004-04-06 |
| 6696356 | Method of making a bump on a substrate without ribbon residue | Li-Hsin Tseng, Hsiu-Mei Yu, Ta-Yang Lin, Fang-Chung Liu, Tung-Heng Shie | 2004-02-24 |