Issued Patents 2004
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6805279 | Fluxless bumping process using ions | Hsin-Hui Lee, Chao-Yuan Su, Yeng-Ming Chen, Kai-Ming Chin, Li-Chi Chen +1 more | 2004-10-19 |
| 6802250 | Stencil design for solder paste printing | Chao-Yuan Su, Hsin-Hui Lee, Yen-Ming Chen, Kai-Ming Ching, Li-Chih Chen | 2004-10-12 |
| 6797075 | Ferris wheel-like stripping or cleaning mechanism for semiconductor fabrication | Kai-Ming Ching, Wen-Hsiang Tseng, Ta-Min Lin, Yen-Ming Chen, Hsin-Hui Lee | 2004-09-28 |
| 6765277 | Microelectronic fabrication with corrosion inhibited bond pad | Yen-Ming Chen, Yang-Tung Fan, Hong-Wen Huang, Cheng-Yu Chu | 2004-07-20 |
| 6756294 | Method for improving bump reliability for flip chip devices | Yen-Ming Chen, Shun-Liang Hsu, Kai-Ming Ching, Hsin-Hui Lee, Chao-Yuan Su +1 more | 2004-06-29 |
| 6743660 | Method of making a wafer level chip scale package | Hsin-Hui Lee, Chao-Yuan Su, Yen-Ming Chen, Kai-Ming Ching, Li-Chih Chen | 2004-06-01 |
| 6715524 | DFR laminating and film removing system | Li-Chen Chen, Chia-Tsun Hsu, Kuo-Ching Lee, Yen-Ming Chen, Kai-Ming Ching +2 more | 2004-04-06 |
| 6712260 | Bump reflow method by inert gas plasma | Wen-Chang Kuo, Sheng-Liang Pan, Szu-Yao Wang, Cheng-Yu Chu | 2004-03-30 |