Issued Patents 2004
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6818565 | Gate insulator pre-clean procedure | Yeuh-Mao Sun, Yan-Fei Lin, Lin Wu | 2004-11-16 |
| 6802250 | Stencil design for solder paste printing | Chao-Yuan Su, Chia-Fu Lin, Hsin-Hui Lee, Kai-Ming Ching, Li-Chih Chen | 2004-10-12 |
| 6797075 | Ferris wheel-like stripping or cleaning mechanism for semiconductor fabrication | Kai-Ming Ching, Chia-Fu Lin, Wen-Hsiang Tseng, Ta-Min Lin, Hsin-Hui Lee | 2004-09-28 |
| D494544 | High density interconnection device | Harjinder Dulai, Colin Szeto, Edward J. Laurin, Steven D. Daniels, Jean-Francois Drolet | 2004-08-17 |
| 6765277 | Microelectronic fabrication with corrosion inhibited bond pad | Chia-Fu Lin, Yang-Tung Fan, Hong-Wen Huang, Cheng-Yu Chu | 2004-07-20 |
| 6756294 | Method for improving bump reliability for flip chip devices | Chia-Fu Lin, Shun-Liang Hsu, Kai-Ming Ching, Hsin-Hui Lee, Chao-Yuan Su +1 more | 2004-06-29 |
| 6743660 | Method of making a wafer level chip scale package | Hsin-Hui Lee, Chia-Fu Lin, Chao-Yuan Su, Kai-Ming Ching, Li-Chih Chen | 2004-06-01 |
| 6715524 | DFR laminating and film removing system | Li-Chen Chen, Chia-Tsun Hsu, Chia-Fu Lin, Kuo-Ching Lee, Kai-Ming Ching +2 more | 2004-04-06 |