Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6765277 | Microelectronic fabrication with corrosion inhibited bond pad | Yen-Ming Chen, Chia-Fu Lin, Yang-Tung Fan, Hong-Wen Huang | 2004-07-20 |
| 6712260 | Bump reflow method by inert gas plasma | Wen-Chang Kuo, Chia-Fu Lin, Sheng-Liang Pan, Szu-Yao Wang | 2004-03-30 |