Issued Patents 2004
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6821813 | Process for bonding solder bumps to a substrate | — | 2004-11-23 |
| 6805279 | Fluxless bumping process using ions | Hsin-Hui Lee, Chia-Fu Lin, Yeng-Ming Chen, Kai-Ming Chin, Li-Chi Chen +1 more | 2004-10-19 |
| 6802250 | Stencil design for solder paste printing | Chia-Fu Lin, Hsin-Hui Lee, Yen-Ming Chen, Kai-Ming Ching, Li-Chih Chen | 2004-10-12 |
| 6770510 | Flip chip process of flux-less no-flow underfill | — | 2004-08-03 |
| 6756294 | Method for improving bump reliability for flip chip devices | Yen-Ming Chen, Chia-Fu Lin, Shun-Liang Hsu, Kai-Ming Ching, Hsin-Hui Lee +1 more | 2004-06-29 |
| 6743660 | Method of making a wafer level chip scale package | Hsin-Hui Lee, Chia-Fu Lin, Yen-Ming Chen, Kai-Ming Ching, Li-Chih Chen | 2004-06-01 |
| 6715524 | DFR laminating and film removing system | Li-Chen Chen, Chia-Tsun Hsu, Chia-Fu Lin, Kuo-Ching Lee, Yen-Ming Chen +2 more | 2004-04-06 |