Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6756294 | Method for improving bump reliability for flip chip devices | Yen-Ming Chen, Chia-Fu Lin, Kai-Ming Ching, Hsin-Hui Lee, Chao-Yuan Su +1 more | 2004-06-29 |
SH
Shun-Liang Hsu
Overall (2004): #117,054 of 270,089Top 45%
1
Patents 2004