Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6784002 | Method to make wafer laser marks visable after bumping process | Hui Wang, Kuo-Wei Lin, Hwei-Mei Yu, Charles Tseng | 2004-08-31 |
| 6696356 | Method of making a bump on a substrate without ribbon residue | Li-Hsin Tseng, Hsiu-Mei Yu, Fang-Chung Liu, Kai-Ming Ching, Tung-Heng Shie | 2004-02-24 |