Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6696356 | Method of making a bump on a substrate without ribbon residue | Li-Hsin Tseng, Ta-Yang Lin, Fang-Chung Liu, Kai-Ming Ching, Tung-Heng Shie | 2004-02-24 |
HY
Hsiu-Mei Yu
Overall (2004): #206,097 of 270,089Top 80%
1
Patents 2004