HY

Hwei-Mei Yu

TSMC: 1 patents #234 of 898Top 30%
📍 Baoshan, TW: #83 of 342 inventorsTop 25%
Overall (2004): #205,454 of 270,089Top 80%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6784002 Method to make wafer laser marks visable after bumping process Hui Wang, Kuo-Wei Lin, Ta-Yang Lin, Charles Tseng 2004-08-31